February 16, 2024
The first investment under the scheme comes from Micron Technology, a US-based company, which will invest US$ 2.75 billion in a semiconductor plant in Gujarat
The semiconductor plant in Gujarat is expected to produce its first packaged chip by December 2024, marking a significant milestone in India's semiconductor manufacturing capabilities
The government has received four proposals for semiconductor manufacturing plants and 13 for chip assembly units
Minister Chandrasekhar highlighted initiatives like futureSKILLS, expressing confidence that India is poised to lead in shaping the future of technology
Assam will have an INR 25,000 crore semiconductor packaging plant, which will be established in partnership with the Assam government and Tata Group, according to Minister of State for Electronics and IT Rajeev Chandrasekhar, speaking at the futureSKILLS Summit in Guwahati.
The government has earmarked INR 76,000 crore as a financial assistance scheme to attract semiconductor fabrication and packaging units in the country. The first investment under the scheme has been made by US-based Micron Technology in Gujarat. The plant will entail an investment of US$ 2.75 billion, US$ 800 million of which will be pumped in by Micron, and the rest will be split between central and state governments. The first packaged chip from the unit is expected by December 2024.
Chandrasekhar said previously that the government had received four proposals for setting up semiconductor manufacturing plants and 13 for chip assembly units. The Minister also spoke about initiatives like futureSKILLS and said that India is poised to lead the way in shaping the future of technology. This endeavour will lead to a globally competitive talent pool accessible not only to Indian companies but also to organisations worldwide, setting a new standard in the global tech landscape.
Source: Economic Times